Hi Dialog,
I am designing a pcb for da1483 using Inverted F antenna design(Full sized IFA) as specified in the Application note AN-B-027.I am using Kicad software for designing.I have successfully imported the dxf files in F.paste ,Bpaste layer and have placed via to interconnect both the top,bottom layers.I want to ask that ,do we need to import antenna as copper trace or is it ok if we use it directly in F.paste layer(solder mask layer?
Thank You.
Keywords:
Device:
Hi Sir,
Here is a feedback after check with our system desgin team:
天线必须铜,直线部分of it must be printed in copper on the top and bottom layer.
It’s advised to cover the copper traces with solder-mask.
The top- and bottom-copper must be stitched together using vias. This 2-sided design makes radiation efficiency better.
The bent feed ‘arm’ is on the top layer only (or on the bottom layer only: it must be at the same layer as where the BLE chip is).
I added 2 photos to make it clear. From 68x Pro-Kit daughterboard.
Top-side (681 side)
see attached
Bottom-side.
The top and bottom side are connected through multiple vias.
The copper traces are covered with solder-mask.
Hi Dialog,
Thanks for the information.I am not able to view the attachments, can you please mail me on my registered email ID?.I also want to know the software where i can check antenna design?
Hi Dialog,
I am not able to see the antenna pictures uploaded above can you please mail me asap.I am about to print the Da14583 pcb , just want to check whether I have not made ant mistake in antenna design.
Thank You
Please check the following post for more infohttp://support.dialog-semiconductor.com/antenna-design-0.
Thanks MT_dialog