![DA14531 Module Front](http://www.xmece.com/sites/default/files/2020-08/da14531_module_front.png)
DA14531 SmartBond TINY™ Module
The Bluetooth® low energy solution that will power the next 1 billion IoT devices through ease of use.
![DA14531 Module Front](http://www.xmece.com/sites/default/files/2020-08/da14531_module_front.png)
The DA14531 SmartBond TINY™ Module is the Bluetooth® low energy solution that will power the next 1 billion IoT devices through ease of use.
The DA14531 SmartBond TINY™ Module, based on the world’s smallest and lowest power Bluetooth 5.1 system-on-Chip, brings the DA14531 SoC advantages to an integrated module. It just requires a power supply and a printed circuit board to build a Bluetooth application.
The module is targeting broad market use and will be certified across regions providing significant savings in development cost and time-to-market.
It comes with an integrated antenna and easy to use software making Bluetooth low energy development easier than ever before.
This awesome combination takes mobile connectivity to applications previously out of reach, enabling of the next billion IoT devices, with SmartBond TINY™ at their core.
Need for a pre-programmed DA14531 TINY Module with your own code?
![](http://www.xmece.com/sites/default/files/inline-images/digikey.png)
DigiKey and EPS Global are selected 3rd parties who provide programming services of small sample to high volume batches.
DigiKey is one of the fastest growing distributors of electronic components in the world. For more information on Digikey’s programming services contactsales@digikey.com.
![](http://www.xmece.com/sites/default/files/inline-images/EPS-Global.jpg)
EPS Global is one of the world's largest programming service providers. For more information on EPS Global’s programming services go towww.epsprogramming.comor contact Munteanu Florentinfmunteanu@epsglobal.com.
Features
Bluetooth 5.1 core qualified
Integrated antenna
全球认证
Cortex-M0+ @16MHz
IoTMark™-BLE score of 18300
23.75uA/MHz MCU current
Memory: 48kB RAM, 32kB OTP &1Mb FLASH
1.8-3.3V Supply Range
+2.2dBM max output power
-93dBm sensitivity
Rx current 2mA at 3V
Tx current 4mA at 3V at 0dBm
Interfaces: 2xUART, SPI, I2C
4-channel 10-bit ADC
8 GPIO
Built-in temperature sensor
Operating temperature: -40°C to +85°C
Dimensions: 12.5x14.5x2.8 mm
亚博国际官网平台网址
Beacons
Remote controls
Proximity tags
Toys
Low power sensors
Bluetooth LE add-on “pipe” to existing applications
Provisioning of any type of equipment providing ease of use with smartphone APP-based based setup and control, eliminating the need for printed user manuals
Related Links
![DA14531 Module block diagram](http://www.xmece.com/sites/default/files/styles/media_row_mobile/public/2021-03/DA14531_Module_block_diagram.png?itok=JX1MJW6h)
DA14531 Block Diagram
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Ordering information
DA14531 SmartBond TINY Module
- Part number: DA14531MOD-00F01002
- Size (mm): 12.5x14.5x2.8
- Shipment Pack Quantity: Reel 1k
Bluetooth Low Energy Development Kit Pro for DA14531
- Part number: DA14531MOD-00DEVKT-P
- Description: Development Kit is based on module samples
Daughterboard for Pro Development Kit
- Part number: DA14531MOD-00F1DB-P
- Description: DA14531 Module Daughterboard for Pro Development Kit
- SmartBond TINY Module: Includes motherboard, daughterboard and cables; Primary usage is SW application development and power measurements
SmartBond TINY Module: Includes motherboard, daughterboard and cables;
Primary usage is SW application development and power measurements
1 month ago
Complete