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DA14531 Smartbond Tiny™ Module

Bluetooth®低能量解决方案将通过易用性为未来10亿个IOT设备供电。

DA14531模块前部

DA14531 SmartBond Tiny™模块是Bluetooth®低能量解决方案,通过易用性,将电源为未来10亿个IOT设备。

DA14531 SmartBond Tiny™模块基于世界上最小和最低功率的蓝牙5.1系统,为集成模块带来DA14531 SOC优势。它只需要电源和印刷电路板来构建蓝牙应用。

The module is targeting broad market use and will be certified across regions providing significant savings in development cost and time-to-market.

It comes with an integrated antenna and easy to use software making Bluetooth low energy development easier than ever before.

This awesome combination takes mobile connectivity to applications previously out of reach, enabling of the next billion IoT devices, with SmartBond TINY™ at their core.

Features

Bluetooth 5.1 core qualified

Integrated antenna

全球认证

Cortex-M0+ @16MHz

iotmark™-ble得分为18300

23.75UA / MHz MCU电流

内存:48KB RAM,32KB OTP&1MB闪存

1.8-3.3V Supply Range

+2.2dBM max output power

-93dBm sensitivity

RX电流2mA在3V时

TX电流4mA在0dBM时3V

Interfaces: 2xUART, SPI, I2C

4通道10位ADC

8 GPIO.

Built-in temperature sensor

工作温度:-40°C至+ 85°C

Dimensions: 12.5x14.5x2.8 mm

亚博国际官网平台网址

信标

Remote controls

近距离标签

Toys

低功率传感器

Bluetooth LE add-on “pipe” to existing applications

Provisioning of any type of equipment providing ease of use with smartphone APP-based based setup and control, eliminating the need for printed user manuals

DA14531模块框图

DA14531.Block Diagram

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Datasheet
Name 日期 Version
DA14531.Module Datasheet(2.08 MB) 25/08/2020 2.3
产品简介
Name 日期 Version
DA14531.SmartBond Tiny Module Product Brief(1.27 MB) 02/07/2020 2.0
SDK
Name 日期 Version
SDK6.0.14.1114.for DA14531 and DA14585/6(9.39 MB) (Registered users only) 29/04/2020 SDK6.0.14.1114.
SDK_6.0.14.1114_hotfix_001(6.31 MB) (Registered users only) 15/07/2020 SDK_6.0.14.1114_hotfix_001
SW-B-002 DA14531 SDK发行说明V.6.0.14.1114(315.84 KB) (Registered users only) 29/04/2020 SDK6.0.14.1114.
SDK用户手册
Name 日期 Version
UM-B-117:DA14531使用Pro开发套件(HTML)入门(25.09 KB) 30/03/2020 1.2
UM-B-117: [Chinese] DA14531 Getting Started with the Pro Development Kit (HTML)(25.09 KB) 30/03/2020 1.2
UM-B-118: DA14585-DA14531 SDK Porting Guide(25.09 KB) 29/04/2020 1.2
UM-B-119:DA14585-DA14531 SW平台参考(25.09 KB) 10/04/2020 2.0
UM-B-143 Dialog External Processor Interface(6.15 MB) 11/12/2020 0.2
Development Tools
Name 日期 Version
对话Smartbond Flash Programmer for Windows OS(4.57 MB) 12/04/2021 1.0.6
对话Smartbond Flash Programmer for Linux OS(8.15 kB) 12/04/2021 1.0.6
对话框SmartBond Flash Programmer for Mac OS(622.12 KB) 12/04/2021 1.0.6
UM-B-138: Programming flash User Manual (HTML)(25.09 KB) 24/03/2020 1.0
软件应用程序和示例亚博国际官网平台网址
Name 日期 Version
对话Serial Port Service (DSPS)(7.58 KB)
SmartBond™ - CodeLess AT Commands(7.58 KB)
软件应用程序和示例亚博国际官网平台网址:蓝牙
Name 日期 Version
DA14531.Booting with Codeless Through a STM32(25.09 KB) 11/01/2021 1.0
DA14531-DA14585 / 586周边BLE-iOS MIDI在GATT配置文件(25.09 KB) 23/11/2020 1.0
STM32 SUOTA via DA14531(25.09 KB) 11/01/2021 1.1
Production Line Tool Kit
Name 日期 Version
Production Line Tool documents(7.58 KB)
申请笔记
Name 日期 Version
AN-B-083 Test jig Tool for DA14531 Tiny Module(759.67 KB) 16/06/2020 1.1
User Guides
Name 日期 Version
UM-B-139: DA14531 Module getting started Guide (HTML)(25.09 KB) 31/03/2020 1.0
UM-B-141: DA14531 SMARTBOND TINY™ MODULE Development Kit Pro Hardware User Manual(2.86 MB) 11/05/2020 1.1
硬件设计抵押品
Name 日期 Version
DA14531.Module Symbols & footprints(25.09 KB) 25/08/2020 1.0
FCC, ETSI certifications
Name 日期 Version
SmartBond-Tiny-Certification-Europe(7.35 MB) 12/05/2020 EN 300 328 V2.2.2 BT4.0-c
SmartBond-Tiny-Certification-FCC(U.S.A)(1.33 MB) 09/05/2020 FCC BT 4.0-d
BT SIG认证
Name 日期 Version
DA14530:配置文件子系统(7.58 KB) 25/08/2020 D051783
DA14531:QDID控制器子系统(7.58 KB) 08/08/2019 D047135
DA14531.: QDID Host Subsystem(7.58 KB) 27/08/2019 D047136
DA14531.: QDID Profile Subsystem(7.58 KB) 31/10/2019 D048316
Other Certifications
Name 日期 Version
SmartBond-Tiny-Certification-Asia(16.72 MB) 12/05/2020 1.0
SmartBond-TINY-Certification-Brazil-Canada(3.53 MB) 12/05/2020 ISED BT 4.0-b
SmartBond-TINY-Certification-Global(4.88 MB) 08/06/2020 SG ITS-21032
SmartBond-Tiny-Certification-Great_China(328.05 KB) 05/06/2020 2020-5042
SmartBond-TINY-Certification-South-Africa(65.41 KB) 28/07/2020 TA-2020/5882
RoHS and Reach
Name 日期 Version
DA14531.Module REACH declaration(192.23 KB) 18/06/2020 1.0
DA14531.Module RoHS declaration(165.43 kB) 18/06/2020 1.0
Ref. Design and Dev. Kit Documentation
Name 日期 Version
DA14531模块子板Devkt:BOM-,布局,设计 - ,Gerber文件(2.31MB) 02/07/2020 C1.3

订购信息

DA14531 Smartbond TinyModule

  • Part number: DA14531MOD-00F01002
  • Size (mm): 12.5x14.5x2.8
  • Shipment Pack Quantity: Reel 1k

DA14531的蓝牙低能量开发KIT PRO

  • 部件号:DA14531MOD-00DEVKT-P
  • 描述:开发套件基于模块样本

专业发展套装的子板

  • Part number: DA14531MOD-00F1DB-P
  • Description: DA14531 Module Daughterboard for Pro Development Kit
  • SmartBond TINY Module: Includes motherboard, daughterboard and cables; Primary usage is SW application development and power measurements

SmartBond TINY Module: Includes motherboard, daughterboard and cables;
主要用法是SW应用程序开发和功率测量

立即购买

Product 店铺
DA14531.module: DA14531MOD-00F0100 Mouser. Digikey Avnet Farnell
Pro开发套件:DA14531MOD-00DEVKT-P Mouser. Digikey Avnet Farnell
Daughterboard for development kit: DA14531MOD-00F1DB-P Mouser. Digikey Farnell